| XYQ-2150 Foam Peeling Machine is mainly used for round foam continuous first for long wafer cutting work, control cutting thickness through change gear (the machine also can choose ball screw and servo control system, change the original gear control cutting thickness, using the latest digital control technology, the operation is more flexible, more accurate cutting precision. |
Technical Specification:
| Model | XYQ-2150 |
| Max cutting size | Φ2000X2150mm |
| Cutting thickness range | 2~25mm |
| Total power | 6.59kw |
| Peeling speed | 25m~30m/min |
| Thickness control | Gear control |
| Machine weight | 1800kg |
| Machine size(LxWxH) | 4560x1650x1950mm |
Remark: The above date of only for reference, all the parameter is subjected to sell the production
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